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US 2024/0279462 A1Published application
Polyphenylene ether-based resin composition and molded article
AssigneeMitsubishi Engineering-Plastics Corporation
InventorYoichi TAKANO
Life of this patent
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Abstract
A polyphenylene ether-based resin composition that is an aspect of the present invention contains 2 to 20 parts by mass of a polypropylene homopolymer (c) and 1 to 25 parts by mass of an inorganic filler (d) with respect to 100 parts by mass of a polyphenylene ether-containing resin (A) containing a polyphenylene ether-based resin (a) or containing the polyphenylene ether-based resin (a) and a styrene-based resin (b).
Claims17
A polyphenylene ether-based resin composition comprising
- 2 to 20 parts by mass of a polypropylene homopolymer (c) and 1 to 25 parts by mass of an inorganic filler (d) with respect to 100 parts by mass of a polyphenylene ether-containing resin (A) containing a polyphenylene ether-based resin (a) or containing the polyphenylene ether-based resin (a) and a styrene-based resin (b).
Dependencies are inferred from the claim text.