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US 2024/0274346 A1Published application
Surface-mounted magnetic-component module
AssigneeMurata Manufacturing Co., Ltd.
InventorsLee FRANCIS, William JARVIS, Takayuki TANGE
Life of this patent
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Abstract
A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.
Claims1
A magnetic-component module comprising:
- a substrate;
- a core on a first surface of the substrate;
- a spacer on the core;
- a winding including:
- wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate;
- and
- traces on and/or in the substrate;
- a lead frame that supports the core and that electrically connects the winding to the substrate;
- and
- an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.
7 more elements
Dependencies are inferred from the claim text.