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US 2024/0270933 A1Published application
Resin composition, molded body using same and method for producing resin composition
AssigneeKuraray Co., Ltd.
InventorsShuichi SUNAGA, Yuta MATSUSHITA, Wenjie LU
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Abstract
A resin composition comprising: a resin (A) having 30 mol % or more of a structural unit represented by a formula (1) below, and a boron compound (B), the boron compound (B) containing a boron element in an amount of 0.01 to 2,000 μmol per gram of the resin (A).
Claims11
A resin composition comprising:
- a resin (A) comprising 30 mol % or more of a structural unit represented by a formula (1) below, and a boron compound (B), the boron compound (B) comprising a boron element in an amount of 0.01 to 2,000 μmol per gram of the resin (A)
A method for producing a resin composition comprising:
- bringing a resin (A) comprising 30 mol % or more of a structural unit represented by a formula (1) below, a boron compound (B) and water into contact with each other
Dependencies are inferred from the claim text.