Layer stacks for a resistive memory element
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsCurtis Chun-I Hsieh, Kai Kang, Wanbing Yi, Yongshun Sun, Eng-Huat Toh, Juan Boon Tan
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AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsCurtis Chun-I Hsieh, Kai Kang, Wanbing Yi, Yongshun Sun, Eng-Huat Toh, Juan Boon Tan
Estimating the term…
Structures that include a layer stack for a resistive memory element and methods of forming a structure that includes a layer stack for a resistive memory element. The structure comprises a resistive memory element including a first electrode, a second electrode, and a switching layer disposed between the second electrode and the first electrode. The first electrode includes a first layer and a second layer between the first layer and the switching layer. The switching layer has a first thickness, and the second layer of the first electrode has a second thickness that is less than the first thickness of the switching layer.
A structure for a random-access resistive memory device, the structure comprising:
A method of forming a structure for a random-access resistive memory device, the method comprising:
Dependencies are inferred from the claim text.