Oled structure and process based on pixel passivation by removing oled stack over heat absorbent structures

A device, comprising:

• a substrate;
• a plurality of pixel-defining layer (PDL) structures disposed over the substrate, each PDL structure has an upper PDL surface;
• and
• a plurality of heat absorbent structures disposed on the upper PDL surface of the plurality PDL structures, each adjacent heat absorbent structure comprising:
• a top surface;
• and
• two sidewalls;
• adjacent heat absorbent structures defining sub-pixels of the device, each sub-pixel comprising:
• an anode;
• an organic light emitting diode (OLED) material disposed over the anode, the OLED material having a first OLED endpoint contacting a first sidewall of a first heat absorbent structure and a second OLED endpoint contacting a second sidewall of a second heat absorbent structure;
• a cathode disposed over the OLED material, the cathode having a first cathode endpoint contacting the first sidewall of the first heat absorbent structure and a second cathode endpoint contacting the second sidewall of the second heat absorbent structure;
• and
• an encapsulation layer disposed over the cathode and over a first portion of the top surface of the first heat absorbent structure and a second portion of the top surface of the second heat absorbent structure.

A method, comprising:

• disposing a first OLED material in a first pixel opening over an anode, second pixel opening, and over a top surface of a plurality of adjacent heat absorbent structures disposed on a substrate, the first pixel opening and the second pixel opening are defined by adjacent heat absorbent structures of the plurality of adjacent heat absorbent structures;
• disposing a cathode over the first OLED material;
• removing the first OLED material and the cathode over the top surface of the plurality of adjacent heat absorbent structures;
• depositing an encapsulation layer over the cathode and over the top surface of the plurality of adjacent heat absorbent structures;
• forming a photoresist over the encapsulation layer in the first pixel opening and over a first portion of the top surface of a first heat absorbent structure and a second portion of the top surface of a second heat absorbent structure;
• and
• removing the encapsulation layer exposed by the photoresist.

A method, comprising:

• disposing a first OLED material in a first pixel opening over an anode, second pixel opening, and over a top surface of a plurality of adjacent heat absorbent structures disposed on a substrate, first pixel opening and the second pixel opening are defined by adjacent heat absorbent structures of the plurality of adjacent heat absorbent structures;
• removing the first OLED material over the top surface of the plurality of adjacent heat absorbent structures;
• disposing a cathode over the first OLED material and over the top surface of the plurality of adjacent heat absorbent structures;
• depositing an encapsulation layer over the cathode;
• forming a photoresist over the encapsulation layer in the first pixel opening and over a first portion of the top surface of a first heat absorbent structure and a second portion of the top surface of a second heat absorbent structure;
• and
• removing the encapsulation layer and cathode exposed by the photoresist and over the first portion of the top surface of the first heat absorbent structure and the second portion of the top surface of the second heat absorbent structure.