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US 2024/0268073 A1Published application
Thermal management in an electronic device chassis
AssigneeRakuten Symphony UK Ltd
InventorGerard MacManus
Life of this patent
Estimating the term…
Abstract
A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling surface has a plurality of heatsink fins extending from the cooling surface. The chassis also has at least one vapor chamber between the mounting surface and the cooling surface. The vapor chamber is located adjacent the plurality of heatsink fins.
Claims18
A chassis for electronic device circuitry, the chassis comprising:
- a mounting surface on a first side of the chassis;
- a cooling surface on a second side of the chassis opposite the mounting surface, the cooling surface having a plurality of heatsink fins;
- at least one vapor chamber between the mounting surface and the cooling surface, the at least one vapor chamber located adjacent the plurality of heatsink fins.
Dependencies are inferred from the claim text.