Electronic control device
AssigneeHitachi Astemo, Ltd.
InventorMinami TERANISHI
Life of this patent
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Abstract
Provided is a cooling technique capable of simultaneously dissipating heat from a plurality of electronic components. An electronic control device includes: a housing including a fin; and a cooling mechanism including a fin cover disposed over the fin to form a flow path for a refrigerant, in which a first electronic component and a second electronic component are in contact with a base surface of the housing via a heat transfer member on a circuit board in the housing, the housing includes a region A having the first electronic component and a region B having the second electronic component, the flow path is longer in the region B than in the region A, the fin cover has a protrusion having a protruding shape on an inner side of the fin cover in the region A, and the flow path is formed in a comb-teeth shape.
Claims19
An electronic control device comprising:
- a housing including a fin;
- and
- a cooling mechanism including a fin cover disposed over the fin to form a flow path for a refrigerant, wherein
- a first electronic component and a second electronic component are in contact with a base surface of the housing via a heat transfer member on a circuit board in the housing,
- the housing includes a region A having the first electronic component and a region B having the second electronic component,
- the flow path is longer in the region B than in the region A,
- the fin cover has a protrusion having a protruding shape on an inner side of the fin cover in the region A, and
- the flow path is formed in a comb-teeth shape.
An electronic control device comprising:
- a first electronic component;
- a second electronic component;
- an upper housing having a base surface and a plurality of fins disposed on an upper side of the base surface;
- a fin cover provided to cover an upper side of the plurality of fins of the upper housing;
- and
- a housing including a first region having a plurality of first flow paths through which a refrigerant for cooling the first electronic component flows, and a second region having a plurality of second flow paths through which a refrigerant for cooling the second electronic component flows, wherein
- the fin cover has a lower surface and a plurality of protrusions provided so as to correspond to a region of the lower surface on an upper side of the first electronic component, and
- each of cross sections of the plurality of first flow paths is configured by a pair of fins among the fins, the base surface, the lower surface of the fin cover, and one of the plurality of protrusions, and
- each of cross sections of the plurality of second flow paths is configured by a pair of fins among the fins, the base surface, and the lower surface of the fin cover.
Dependencies are inferred from the claim text.