Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJesang Park, Changgun Oh, Yangje Lee, Hyun Kyung Park
Life of this patent
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Abstract
A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.
Claims20
A circuit board comprising:
- a first insulation layer;
- a first circuit wire that is disposed on the first insulation layer;
- a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer;
- and
- a third insulation layer that is disposed on the second insulation layer and includes a cavity,
- wherein a bottom surface of the cavity is a top surface of the second insulation layer.
A manufacturing method of a circuit board, comprising:
- forming a first circuit wire on a first insulation layer;
- forming a mask layer that includes a second insulation layer covering the first circuit wire and a conductive layer disposed on the second insulation layer;
- forming an anti-etching layer by etching a part of the conductive layer of the mask layer;
- forming a third insulation layer that covers the anti-etching layer;
- forming a second circuit wire on the third insulation layer;
- and
- forming a cavity by removing a portion containing the anti-etching layer and the dummy wire from the third insulation layer.
Dependencies are inferred from the claim text.