Solder mounting land and charger
AssigneePanasonic Automotive Systems Co., Ltd.
InventorHiroyuki HOSOI
Life of this patent
Estimating the term…
Abstract
A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.
Claims17
A solder mounting land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering, the solder mounting land comprising:
- a first region to which the electronic component is bonded;
- and
- a second region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.
A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land comprising:
- a first region formed by exposing a conductive layer of a substrate from a solder resist layer stacked on an upper surface of the conductive layer, the electronic component being to be bonded to the first region;
- and
- a groove formed by exposing a layer underneath the conductive layer, and extending from an inside to a peripheral edge portion of the first region to divide the first region.
Dependencies are inferred from the claim text.