Back to results
US 2024/0268019 A1Published application
Micro light-emitting package
AssigneeLextar Electronics Corporation
InventorsHsin-Lun SU, Jo-Hsiang CHEN, Chun-Min LIN
Life of this patent
Estimating the term…
Abstract
A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.
Claims10
A micro light-emitting package, comprising:
- a multilayer resin wiring board including a black resin structure and a conductive structure disposed in the black resin structure;
- a plurality of micro LED chips arranged on the multilayer resin wiring board and electrically-connected to the conductive structure;
- and
- an encapsulating layer covering the plurality of micro LED chips.
1 more element
Dependencies are inferred from the claim text.