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US 2024/0268018 A1Published application
Insulating substrate, electrical wiring substrate, thermal print head and manufacturing methods thereof
AssigneeRohm Co., Ltd.
InventorGORO NAKATANI
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Abstract
The present disclosure provides an insulating substrate. The insulating substrate includes a ceramic substrate having a main surface and a planarization layer covering the main surface. The planarization layer is a ceramic layer.
Claims14
An insulating substrate, comprising:
- a ceramic substrate, including a main surface;
- and
- a planarization layer, covering the main surface, wherein
- the planarization layer is a ceramic layer.
1 more element
A method for manufacturing an insulating substrate, comprising:
- preparing a ceramic substrate including a main surface;
- and
- forming a planarization layer by applying a first paste onto the main surface and sintering the first paste, wherein
- the planarization layer is a ceramic layer.
1 more element
Dependencies are inferred from the claim text.