Circuit board
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsKI HUN SUNG, DAE KYU KIM, HEE JUN PARK, SUNG JOON HONG
Life of this patent
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Abstract
A circuit board includes a core layer, a first via structure penetrating the core layer, a circuit wiring disposed on one surface of the core layer and including a head portion in contact with the first via structure, a connection portion extending from the head portion and an extension portion electrically connected to the head portion through the connection portion, and a first ground pattern disposed on the one surface of the core layer and disposed around the circuit wiring to be spaced apart from the circuit wiring. A shortest distance between the extension portion and the first ground pattern is greater than a shortest distance between the head portion and the first ground pattern.
Claims15
A circuit board comprising:
- a core layer;
- a first via structure penetrating the core layer;
- a circuit wiring disposed on one surface of the core layer, the circuit wiring comprising a head portion in contact with the first via structure, a connection portion extending from the head portion, and an extension portion electrically connected to the head portion through the connection portion;
- and
- a first ground pattern disposed on the one surface of the core layer and disposed around the circuit wiring to be spaced apart from the circuit wiring,
- wherein a shortest distance between the extension portion and the first ground pattern is greater than a shortest distance between the head portion and the first ground pattern.
Dependencies are inferred from the claim text.