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US 2024/0267017 A1Published application
Manufacturing method for acoustic wave element and acoustic wave element
AssigneeMurata Manufacturing Co., Ltd.
InventorShinya JONOSONO
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AssigneeMurata Manufacturing Co., Ltd.
InventorShinya JONOSONO
Estimating the term…
A manufacturing method for an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, the support substrate including a hollow portion at a position overlapping a portion of the functional electrode in a lamination direction of the support substrate and the piezoelectric material layer. The manufacturing method includes preparing a wafer, attaching the wafer to a dicing tape, dicing the wafer to singulate the acoustic wave element, and butting at least one pin against the acoustic wave element with the dicing tape interposed therebetween, to separate the acoustic wave element from the dicing tape and pick up the acoustic wave element. A position at which the at least one pin is butted against the acoustic wave element is located at a position different from the hollow portion in the lamination direction.
A manufacturing method for an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, the support substrate including a hollow portion at a position overlapping a portion of the functional electrode in a lamination direction of the support substrate and the piezoelectric material layer, the manufacturing method comprising:
An acoustic wave element, comprising:
An acoustic wave element, comprising:
Dependencies are inferred from the claim text.