Method for manufacturing acoustic wave element and acoustic wave element
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakashi YAMANE, Kazunori INOUE, Shinya JONOSONO, Naohiro NODAKE, Shintaro KUBO
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Abstract
A method for manufacturing an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, includes preparing a wafer in which the support substrate and the piezoelectric material layer are laminated, thinning the support substrate of the wafer, and after the thinning the support substrate, cutting the wafer with a dicing machine to singulate the acoustic wave element.
Claims19
A method for manufacturing an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, the method comprising:
- preparing a wafer in which the support substrate and the piezoelectric material layer are laminated;
- thinning the support substrate of the wafer;
- and
- after the thinning the support substrate, cutting the wafer with a dicing machine to singulate the acoustic wave element.
An acoustic wave element comprising:
- a support substrate including a first surface and a second surface opposing each other;
- a piezoelectric material layer on the first surface;
- and
- a functional electrode on the piezoelectric material layer;
- wherein
- a surface roughness of the second surface is rougher than a surface roughness of the piezoelectric material layer;
- and
- the support substrate has a thickness of about 250 μm or less.
Dependencies are inferred from the claim text.