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US 2024/0266803 A1Published application
Alignment of a laser chip and anotehr chip using a selective coupler
AssigneeDustPhotonics
InventorsYoel Chetrit, Israel Weiss
Life of this patent
Estimating the term…
Abstract
A method for operating multiple chip regions. The method includes aligning the multiple chip regions using first wavelength band signals, and conveying transmission signals of a second wavelength band signals. The multiple chip regions may be without a second wavelength band transmitter and include a path for receiving the second wavelength band signals from another chip.
Claims20
A method for operating multiple chip regions, the method comprises:
- aligning the multiple chip regions using optical probe signals of a first wavelength band that are sent to an alignment path that is formed within the multiple chip regions and ends with a detector of the first chip region, wherein an attenuation value of the alignment path is indicative of an alignment between the multiple chip regions;
- wherein the multiple chip regions comprise the first chip region, a second chip region and an intermediate chip region located between the first chip region and the second chip region;
- wherein the intermediate chip is at least partially transparent to a second wavelength band and to the first frequency wavelength band;
- wherein the second chip region comprises an active electrooptical component that is idle during the aligning step;
- wherein spaced apart ports of the second chip region are optically coupled to the active electrooptical component;
- receiving, following the aligning of the multiple chip regions, from a second wavelength source that is external to the multiple chip regions, a transmitted optical signal of the second wavelength band, the second wavelength band does not overlap the first wavelength band;
- conveying the transmitted optical signal, through an ingress part of a transmission path formed within the multiple chip regions, to the active electrooptical component;
- electrooptically processing the transmitted optical signal by the active electrooptical component to provide a processed transmitted optical signal;
- and
- outputting, through an egress part of the transmission path, the processed transmitted optical signal from the multiple chip regions;
- and
- wherein an ingress part of the alignment path and the ingress part of the transmission path share at least a first combiner, and the spaced apart ports.
9 more elements
Multiple chip regions, the multiple chip regions comprise:
- a first chip region that comprises a first wavelength band input, a first wavelength band detector, a first wavelength band coupler, a first combiner, a second wavelength band input, second wavelength band output, and wavelength selective coupler (WSC) comprising a first WSC port, a second WSC port and a third WSC port;
- an intermediate chip region that is at least partially transparent to a second wavelength band and to the first frequency wavelength band;
- a second chip region that comprises spaced apart ports and an active electrooptical component;
- wherein the multiple chips regions form an alignment path and a transmission path, each path optically couples the multiple chip regions to each other, wherein an attenuation value of the alignment path is indicative of an alignment between the multiple chip regions.
- wherein an ingress part of the alignment path comprises the first wavelength band input, the first wavelength band input, the first wavelength band coupler, the first combiner, the first WSC port, the third WSC port, a first WSC path between the first WSC port and the third WSC port, the intermediate chip region, a first port of the spaced apart ports;
- wherein an egress part of the alignment path comprises a second port of the spaced apart ports, the intermediate chip region, the third WSC port, the first WSC path, the first WSC port, the first combiner, the first wavelength band coupler, and the first detector;
- wherein an ingress part of the transmission path comprises a second wavelength band input, the first combiner, the first WSC port, the third WSC port, the first WSC path, the intermediate chip region, and the first port of the spaced apart ports;
- wherein an egress part of the transmission path comprises the second port of the spaced apart ports, the intermediate chip region, the third WSC port, the second WSC path between the second WSC port and the third WSC port, and the second wavelength band output.
5 more elements
Dependencies are inferred from the claim text.