Supported metal catalyst and production method thereof

A manufacturing method of a supported metal catalyst, comprising:

• an initial addition step;
• a simultaneous addition step;
• a supporting step;
• and a step to enhance regular arrangement, wherein:
• in the initial addition step, an oxidizing agent that oxidizes an active metal precursor to form oxide particles of active metal is added to an active metal precursor solution containing the active metal precursor to generate a colloid;
• in the simultaneous addition step, a neutralizing agent and the oxidizing agent are added simultaneously to the colloid until an amount of the oxidizing agent added reaches a specified amount;
• in the supporting step, a support which is a collective body of conductive particles and the colloid are mixed to support the oxide particles on the conductive particles;
• in the step to enhance regular arrangement, a regular arrangement of the oxide particles or active metal particles generated by reducing the oxide particles is achieved by performing an arrangement treatment;
• the conductive particles include a plurality of pores;
• an average entrance pore diameter of the pores is 1 to 20 nm;
• and
• a standard deviation of the average entrance pore diameter is equal to or less than 50% of the average entrance pore diameter.

A manufacturing method of a supported metal catalyst, comprising:

• a first step;
• a surfactant removal step;
• and a second step, wherein:
• the first step comprises a first mixing step, a first reduction step, and a first supporting step;
• the second step comprises a second mixing step, a second reduction step, and a second supporting step;
• in the first mixing step, a first active metal precursor mixed solution is generated by mixing an active metal precursor solution containing an active metal precursor with a surfactant and an organic solvent;
• in the first reduction step, active metal particles are generated by a reduction of the active metal precursor in the first active metal precursor mixed solution;
• in the first supporting step, a support which is a collective body of conductive particles and the active metal particles are mixed to disperse and support the active metal particles on the conductive particles;
• in the surfactant removal step, a surfactant adhered to the support is removed;
• in the second mixing step, a second active metal precursor mixed solution is generated by mixing an active metal precursor solution containing an active metal precursor with a surfactant and an organic solvent;
• in the second reduction step, active metal particles are generated by a reduction of the active metal precursor in the second active metal precursor mixed solution;
• in the second supporting step, the support after the surfactant removal step and the active metal particles obtained in the second reduction step are mixed to disperse and support the active metal particles obtained in the second reduction step on the conductive particles;
• the conductive particles include a plurality of pores;
• an average entrance pore diameter of the pores is 1 to 20 nm;
• a standard deviation of the average entrance pore diameter is equal to or less than 50% of the average entrance pore diameter;
• and
• a count median diameter measured in the first or second active metal precursor mixed solution by a dynamic light scattering method is 0.5 to 2 times as large as the average entrance pore diameter.