Light-emitting device
AssigneeQuanzhou Sanan Semiconductor Technology Co., Ltd.
InventorsChen-ke HSU, Changchin YU, Zhaowu HUANG, Junpeng SHI, Weng-Tack WONG
Life of this patent
Estimating the term…
Loading patent…
AssigneeQuanzhou Sanan Semiconductor Technology Co., Ltd.
InventorsChen-ke HSU, Changchin YU, Zhaowu HUANG, Junpeng SHI, Weng-Tack WONG
Estimating the term…
A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip.
A light-emitting device, comprising:
Dependencies are inferred from the claim text.