Photonic Semiconductor Device and Method of Manufacture

A device comprising:

• a first interconnect structure comprising:
• a plurality of vias on a front side of a first redistribution structure;
• a plurality of interconnect devices on the front side of the first redistribution structure, wherein the interconnect devices are free of active devices, wherein each interconnect device respectively comprises a plurality of through-vias in a substrate;
• a molding material on the first redistribution structure, wherein the molding material separates the plurality of vias and the plurality of interconnect devices;
• and
• a second redistribution structure extending over the plurality of vias and the plurality of interconnect devices;
• a photonic package on a front side of the second redistribution structure, wherein the photonic package comprises a waveguide, wherein the photonic package is electrically coupled to at least one interconnect device;
• and
• a first die on the front side of the second redistribution structure, wherein the first die is electrically coupled to at least one interconnect device.

A method comprising:

• forming a plurality of vias on a first interconnect structure;
• attaching a plurality of interconnect devices to the first interconnect structure, and wherein each interconnect device comprises conductive routing;
• encapsulating the plurality of vias and the plurality of interconnect devices with an encapsulant;
• forming a second interconnect structure over a first side of the plurality of vias, the plurality of interconnect devices, and the encapsulant, wherein the second interconnect structure is electrically connected to the plurality of vias and to the plurality of interconnect devices;
• bonding a first semiconductor die to the first interconnect structure, wherein the first semiconductor die is electrically connected to a first interconnect device of the plurality of interconnect devices;
• and
• bonding a photonic package to the first interconnect structure, wherein the photonic package is electrically connected to the first interconnect device of the plurality of interconnect devices, and wherein the photonic package comprises a photonic component that is optically coupled to a waveguide of the photonic package and electrically coupled to a semiconductor device of the photonic package.