Package structure and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
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Abstract
An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.
Claims20
A structure comprising:
- a first package comprising:
- a first die;
- and
- a first molding compound encapsulating the first die;
- a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, a dielectric layer of the first package is disposed at a surface of the first package opposite the second package, the dielectric layer comprises a recess free of any metallic features, and the recess is surrounded by the dielectric layer in a top down view;
- and
- an underfill between the first package and the second package, the underfill surrounding the first set of conductive connectors.
A package comprising:
- a first package comprising a first semiconductor die;
- a second package over and bonded to the first package with a first set of conductive connectors, the second package comprising a second semiconductor die laterally encapsulated by a first molding compound;
- and
- an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a sidewall extending up along a sidewall of the first molding compound of the second package, the sidewall comprises:
- a linear portion;
- and
- a curved portion above and adjoined to the linear portion, wherein a point where the curved portion adjoins the linear portion is above a bottom surface of the first molding compound.
A structure comprising:
- a first redistribution structure comprising metallization patterns in dielectric layers, a bottommost dielectric layer of the dielectric layers has a recess, the recess is bounded on opposing sides by portions of the bottommost dielectric layer, and the recess is free of any metallic features;
- a first die over and electrically coupled to the first redistribution structure;
- a molding compound encapsulating the first die;
- a second redistribution structure over the molding compound;
- a semiconductor package over and bonded to the second redistribution structure, the semiconductor package comprising a second die;
- and
- an underfill between the semiconductor package and the second redistribution structure and extending along a sidewall of the semiconductor package.
Dependencies are inferred from the claim text.