US 2024/0266335 A1 · ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

Abstract

An electronic package and the manufacturing method thereof are provided, in which a first electronic element and a second electronic element are disposed on a carrier structure, and the first electronic element and the second electronic element are electrically connected to each other by a wire. Therefore, by replacing some layers of the circuit layer of the carrier structure with the wire, the carrier structure can satisfy the functional signal transmission of the first and second electronic elements without configuring too many circuit layers, so as to shorten the process steps and time of the carrier structure, thereby effectively reducing the manufacturing cost of the electronic package.

Claims20

Dependent claims

An electronic package, comprising:

a carrier structure having a first surface and a second surface opposing the first surface, the carrier structure including an insulating layer and a circuit layer formed on the insulating layer;
a first electronic element disposed on the first surface of the carrier structure and electrically connected to the circuit layer;
a second electronic element disposed on the first surface of the carrier structure and electrically connected to the circuit layer, wherein the first electronic element and the second electronic element are electrically connected to each other by a wire;
and
a packaging layer formed on the first surface of the carrier structure and covering the wire, the first electronic element and the second electronic element.

2 more elements

Dependencies are inferred from the claim text.

Electronic package and fabricating method thereof

Life of this patent

Electronic package and fabricating method thereof

Life of this patent

Abstract

Claims20