Methods for manufacturing electronic device and transfer device

A method for manufacturing a transfer device, comprising:

• providing a first substrate, wherein the first substrate comprises a plurality of recesses;
• coating an adhesive layer on the first substrate, wherein the adhesive layer comprises a plurality of protruding portions filled into the recesses and a first layer on the plurality of protruding portions;
• attaching a transfer head to a surface of the first layer where the protruding portions are not formed;
• curing the adhesive layer;
• and
• removing the first substrate.

A method for manufacturing an electronic device, comprising:

• providing a plurality of elements;
• providing a substrate;
• transferring the plurality of elements to a transfer head;
• and
• attaching at least one of the plurality of elements on the transfer head to the substrate by a bonding process;
• wherein, during the bonding process, a temperature of the transfer head is T2, a temperature of the substrate is T3, a coefficient of thermal expansion of the transfer head is different from a coefficient of thermal expansion of the substrate, and T2 is different from T3.