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US 2024/0266318 A1Published application
Bonding systems for bonding a semiconductor element to a substrate, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsAdeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman, Robert N. Chylak
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Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.
Claims26
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- a manifold configured to provide a reducing gas to a bonding area of the bonding system;
- and
- a heating element for heating at least a portion of the manifold.
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) directing a reducing gas from a reducing gas source to a manifold of a bonding system, the manifold distributing the reducing gas to a bonding area of the bonding system;
- (b) heating the manifold;
- and
- (c) bonding a semiconductor element to a substrate at the bonding area.
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Dependencies are inferred from the claim text.