Method of fabricating semiconductor package and semiconductor package structure including the semiconductor package

A method of fabricating a semiconductor package structure, the method comprising:

• forming a first semiconductor package including forming a first protective layer exposing a first conductive pad above a first surface of a first semiconductor substrate, forming a second protective layer covering the first conductive pad on the first protective layer, performing a soft-baking of the second protective layer, and removing the second protective layer to expose the first conductive pad;
• forming a second semiconductor package including forming a third protective layer exposing a second conductive pad above a first surface of a second semiconductor substrate, forming a fourth protective layer covering the second conductive pad on the third protective layer, and removing the fourth protective layer to expose the second conductive pad;
• and
• mounting the first semiconductor package on a package substrate and the second semiconductor package on the first semiconductor package.

A method of fabricating a semiconductor package, the method comprising:

• forming a passivation layer and a first protective layer covering a semiconductor substrate and a conductive pad above a first surface of the semiconductor substrate, the first protective layer including a photosensitive material;
• removing a portion of the passivation layer and a portion of the first protective layer to expose the conductive pad;
• performing a hard-baking of the first protective layer;
• forming a second protective layer covering the conductive pad on the first protective layer;
• grinding a second surface opposite the first surface of the semiconductor substrate;
• dicing the semiconductor substrate;
• removing the second protective layer to expose the conductive pad;
• and
• connecting the exposed conductive pad to a conductive connector;
• wherein the second protective layer does not expose the conductive pad in the grinding operation and the dicing operation.