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US 2024/0266303 A1Published application
Chiplet interposer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu
Life of this patent
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Abstract
Embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure over the substrate which includes metallization patterns which are stitched together in a patterning process which includes multiple lateral overlapping patterning exposures.
Claims20
A package comprising:
- a first device, the first device laterally encapsulated by a first encapsulant;
- a first interposer, the first interposer comprising a dielectric fill layer, the first interposer free of a silicon layer, the first interposer laterally encapsulated by a second encapsulant;
- and
- external connectors, one or more of the external connectors electrically coupled to the first device by way of the first interposer.
1 more element
A package device comprising:
- one or more embedded devices;
- a first encapsulant layer, the first encapsulant layer encapsulating the one or more embedded devices;
- one or more chiplet interposers, each of the one or more chiplet interposers having a substrate comprising a first material having a Young's modulus between 50 GPa and 100 GPa;
- a second encapsulant layer, the second encapsulant layer encapsulating the one or more chiplet interposers;
- a first redistribution structure disposed between the first encapsulant layer and the second encapsulant layer;
- and
- external connectors, wherein one or more of the external connectors are electrically coupled to the one or more embedded devices and to the one or more chiplet interposers.
4 more elements
A package device comprising:
- a first chiplet and a second chiplet, each of the first chiplet and the second chiplet comprising an insulating layer and a first redistribution structure, the first chiplet and the second chiplet being free of active devices;
- a first encapsulant laterally adjacent the first chiplet and the second chiplet;
- a second redistribution structure over the first chiplet, the second chiplet, and the first encapsulant;
- a plurality of device dies attached to the first redistribution structure, wherein the second redistribution structure is between the plurality of device dies and the first chiplet;
- a second encapsulant laterally adjacent the plurality of device dies;
- and
- a third redistribution structure over the first chiplet, the second chiplet, and the first encapsulant, wherein the first chiplet and the second chiplet is between the third redistribution structure and the second redistribution structure.
4 more elements
Dependencies are inferred from the claim text.