Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devices

A semiconductor structure, comprising:

• a substrate comprising a dielectric structure and a conductive structure, wherein the conductive structure comprises an interconnect terminal, and the interconnect terminal comprises a concave recess exposed from the dielectric structure at a lateral side of the substrate and a bottom side of the substrate;
• a first plating on a top side of the interconnect terminal;
• a first electronic component over a top side of the conductive structure;
• a package body over the top side of the conductive structure and covering a lateral side of the first electronic component;
• and
• a component interconnect in the package body coupled with the first electronic component and coupled to the interconnect terminal via the first plating.

A method to manufacture a semiconductor structure, comprising:

• providing a substrate comprising a dielectric structure and a conductive structure, wherein the conductive structure comprises an interconnect terminal, and the interconnect terminal comprises a concave structure exposed from the dielectric structure at a lateral side of the substrate and a bottom side of the substrate;
• providing a first plating on a top side of the interconnect terminal;
• providing a first electronic component over a top side of the conductive structure;
• providing a component interconnect coupled with the first electronic component and coupled to the interconnect terminal via the first plating;
• and
• providing a package body over the top side of the conductive structure and covering the component interconnect and a lateral side of the first electronic component.

A semiconductor structure, comprising:

• a substrate comprising a dielectric structure and a conductive structure;
• a first electronic component over a top side of the conductive structure and coupled to the conductive structure;
• a second electronic component over the top side of the conductive structure and coupled to the conductive structure;
• a package body over the top side of the conductive structure and covering a lateral side of the first electronic component and a lateral side of the second electronic component;
• a vertical shield structure in the package body between the first electronic component and the second electronic component;
• and
• a shield over the package body and covering a lateral side of the package body.