Photonics integrated circuit package

A method for producing an integrated circuit package, the method comprising:

• electrically coupling at least one discrete optical die (oDie) to an electronic die (eDie);
• forming a molded portion around a portion of the oDie and a portion of the eDie;
• removing at least a portion of the molded portion;
• forming at least one redistribution layer at a location of the molded portion corresponding to the removed portion;
• forming at least one protection layer on the at least one redistribution layer, wherein the at least one redistribution layer located between the molded portion and a first side of the integrated circuit package couples at least one of the oDie and/or the eDie to a conductive portion located at the first side of the of the integrated circuit package;
• forming a plurality of through package vias, wherein the through package vias are located in a portion of the molded portion such that the at least one of the oDie and/or the eDie are located between two through package vias of the plurality of through package vias in a cross-section view;
• and
• coupling an optical interconnect to the oDie, wherein the optical interconnect is arranged and configured to receive light from an optical fiber and to forward the light to a detector portion of the oDie.