Electronic package module and method for fabrication of the same

A method for fabricating an electronic package module, comprising:

• providing a circuit substrate comprising a first surface;
• disposing an interposer frame and at least one first electronic component on the first surface, wherein the interposer frame comprises an interface far away from the circuit substrate;
• forming a first molding layer on the first surface, wherein the first molding layer encapsulates the first electronic component and the interposer frame;
• disposing a shielding material on the first molding layer, wherein the shielding material covers the interposer frame, wherein the shielding material has at least one opening, and the opening overlaps the first electronic component;
• depositing a heat conductive solder on the first molding layer with the shielding material as a mask, wherein the heat conductive solder does not directly contact the first electronic component;
• removing the shielding material after depositing the heat conductive solder;
• and
• connecting the interposer frame to a main board after removing the shielding material, wherein the interface of the interposer faces to the main board.