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US 2024/0266274 A1Published application
Semiconductor device
AssigneeSumitomo Electric Industries, Ltd.
InventorNoriyoshi SUDA
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, a lead frame, and a bonding wire. The lead frame includes a base portion on which the semiconductor chip is mounted, a first lead separated from the base portion and electrically connected to the semiconductor chip, and a second lead separated from the base portion, and the bonding wire electrically connects the base portion to the second lead.
Claims10
A semiconductor device comprising:
- a semiconductor chip;
- a lead frame;
- and
- a bonding wire;
- wherein the lead frame includes a base portion on which the semiconductor chip is mounted, a first lead separated from the base portion and electrically connected to the semiconductor chip, and a second lead separated from the base portion, and
- the bonding wire electrically connects the base portion to the second lead.
3 more elements
Dependencies are inferred from the claim text.