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US 2024/0266265 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsMai SAITO, Naoyuki KANAI
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Abstract
A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.
Claims7
A semiconductor device comprising:
- a semiconductor element;
- a terminal to which a wire is coupled;
- a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire;
- and
- an encapsulant sealing an internal space surrounded by the housing,
- wherein the terminal includes a recess-shaped or protrusion-shaped coupling region including the coupling portion coupled to the wire.
3 more elements
Dependencies are inferred from the claim text.