Semiconductor packages with wettable flanks and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsHui Min LER, Swee Har KHOR, Ziming CHANG, Kok Yang LAU, Heng Giap ONG
Life of this patent
Estimating the term…
Abstract
Implementations of a method of providing wettable flanks on leads of a semiconductor package may include applying mold compound around a plurality of leads included in a leadframe; electroplating exposed portions of the plurality of leads; cutting at least one lead of the plurality of leads to expose a flank of the least one lead; applying an electrically conductive layer over the plurality of leads; electroplating the flank of the at least one lead to render the flank wettable; removing the electrically conductive layer from the plurality of leads; and singulating to form a semiconductor package.
Claims20
A method of providing wettable flanks on leads of a semiconductor package, the method comprising:
- applying mold compound around a plurality of leads comprised in a leadframe;
- electroplating exposed portions of the plurality of leads;
- cutting at least one lead of the plurality of leads to expose a flank of the least one lead;
- applying an electrically conductive layer over the plurality of leads;
- electroplating the flank of the at least one lead to render the flank wettable;
- removing the electrically conductive layer from the plurality of leads;
- and
- singulating to form a semiconductor package.
A method of providing wettable flanks on leads of a plurality of semiconductor packages, the method comprising:
- applying mold compound around a plurality of leads comprised in a semiconductor package, the semiconductor package one of a plurality of semiconductor packages comprised in a leadframe panel;
- electroplating exposed portions of the plurality of leads;
- cutting at least one lead of the plurality of leads to expose a flank of the least one lead;
- applying an electrically conductive layer over the plurality of leads;
- electroplating the flank of the at least one lead to render the flank wettable;
- removing the electrically conductive layer;
- and
- singulating the leadframe panel to form a plurality of semiconductor packages.
A method of providing wettable flanks on leads of a plurality of semiconductor packages, the method comprising:
- applying mold compound around a plurality of leads comprised in a semiconductor package, the semiconductor package one of a plurality of semiconductor packages comprised in a leadframe panel;
- electroplating exposed portions of the plurality of leads;
- cutting at least one lead of the plurality of leads to form a plurality of cut leads each comprising a flank;
- coupling a jig over the plurality of leads, the jig providing an electrical connection to each of the plurality of cut leads;
- electroplating the plurality of cut leads to render the flank of each cut lead wettable;
- removing the jig from the plurality of leads;
- and
- singulating the leadframe panel to form a plurality of semiconductor packages.
Dependencies are inferred from the claim text.