Semiconductor apparatus
AssigneeMitsubishi Electric Corporation
InventorsMamoru TOGAMI, Kosuke YAMAGUCHI, Shogo SHIBATA, Kazufumi OKI
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Abstract
According to the present disclosure, a semiconductor apparatus comprises a plurality of integrated circuits, an IC frame on which the plurality of integrated circuits are mounted, and a sealing material. The IC frame comprises a first protrusion extending in a longitudinal direction of the IC frame, a second protrusion positioned on the opposite side to the first protrusion in the IC frame and extending in an opposite direction to the first protrusion, and a third protrusion extending in a direction perpendicular to the longitudinal direction of the IC frame and incorporated in the sealing material.
Claims7
A semiconductor apparatus comprising:
- a plurality of integrated circuits, an IC frame on which the plurality of integrated circuits are mounted, and a sealing material, wherein
- the IC frame comprises
- a first protrusion extending in a longitudinal direction of the IC frame,
- a second protrusion positioned on the opposite side to the first protrusion in the IC frame and extending in an opposite direction to the first protrusion, and
- a third protrusion extending in a direction perpendicular to the longitudinal direction of the IC frame and incorporated in the sealing material.
Dependencies are inferred from the claim text.