Chip-on-chip power card having embedded thermal conductor
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng ZHOU, Tianzhu FAN
Life of this patent
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Abstract
A power card for use in a vehicle includes a N lead frame, a P lead frame, and an O lead frame. The O lead frame includes, in part, an embedded copper-graphite thermal conductor. Part of the O lead frame is located between the N lead frame and the P lead frame. A first power device is located on a first side of the O lead frame between the N lead frame and the O lead frame. A second power device being located on a second side of the O lead frame between the O lead frame and the P lead frame. The O lead frame is configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation.
Claims20
A power card for use in a vehicle, the power card comprising:
- a N lead frame;
- a P lead frame;
- an O lead frame comprising in part an embedded copper-graphite thermal conductor, part of the O lead frame being located between the N lead frame and the P lead frame;
- a first power device being located on a first side of the O lead frame between the N lead frame and the O lead frame;
- and
- a second power device being located on a second side of the O lead frame between the O lead frame and the P lead frame, the O lead frame configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation.
A power system comprising:
- a power card having:
- an O lead frame comprising in part an embedded copper-graphite thermal conductor, part of the O lead frame being located between a N lead frame and a P lead frame;
- a first power device being located on a first side of the O lead frame between the N lead frame and the O lead frame;
- and
- a second power device being located on a second side of the O lead frame between the O lead frame and the P lead frame, the O lead frame configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation.
Dependencies are inferred from the claim text.