Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool
AssigneeSTMicroelectronics S.r.l.
InventorsMauro MAZZOLA, Matteo DE SANTA
Life of this patent
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Abstract
In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.
Claims15
A semiconductor product substrate, comprising:
- a semiconductor die mounting area configured to receive at least one semiconductor die for mounting thereon;
- and
- an array of electrically-conductive leads;
- wherein the electrically-conductive leads of said array comprise at least one force transmitting surface configured to directly receive a pressure force applied thereon by a clamping tool, separate from a bonding tool, during bonding tool operation to bond electrical wire-like connections to said electrically-conductive leads;
- and
- wherein said at least one force transmitting surface of the electrically-conductive leads comprises at least one of a convex surface and a concave surface.
A semiconductor product, comprising:
- a semiconductor product substrate comprising:
- a semiconductor die mounting area;
- and
- an array of electrically-conductive leads;
- wherein the electrically-conductive leads of said array comprise at least one force transmitting surface configured to directly receive a pressure force applied thereon by a clamping tool, separate from a bonding tool, during bonding tool operation to bond electrical wire-like connections to said electrically-conductive leads;
- and
- wherein said at least one force transmitting surface of the electrically-conductive leads comprises at least one of a convex surface and a concave surface;
- at least one semiconductor die mounted to said semiconductor die mounting area;
- and
- electrical wire-like connections between said electrically-conductive leads and said at least one semiconductor die.
An electrically-conductive lead clamping tool separate from a wire bonding tool and configured for co-operation with a semiconductor product substrate, wherein said semiconductor product substrate includes a semiconductor die mounting area and an array of electrically-conductive leads, with said electrically-conductive leads including at least one force transmitting surface, said at least one force transmitting surface including at least one of a convex surface and a concave surface, said electrically-conductive lead clamping tool comprising:
- at least one distal force transmitting surface selected out of a convex surface and a concave surface configured to co-operate in a complementary manner with the concave surface or convex surface, respectively, of the at least one force transmitting surface of said electrically-conductive leads.
Dependencies are inferred from the claim text.