Lead bonding structure comprising embedded manifold type micro-channel and preparation method for lead bonding structure

Abstract

The present invention relates to a wire bonding structure with an embedded manifold type micro-channel. The wire bonding structure includes: a chip, including a substrate and an embedded micro-channel located on a back portion of the substrate; an interposer, including a manifold channel, a liquid inlet, and a liquid outlet; a low-temperature sealing layer, configured to hermetically communicate the embedded micro-channel with the manifold channel, wherein the low-temperature sealing layer is located between the chip and the interposer; and a bonding wire, configured to electrically connect the chip to the interposer. The present invention further relates to a preparation method of a wire bonding structure with an embedded manifold type micro-channel. The wire bonding structure of the present invention has both low-temperature process compatibility and packaging compatibility, and further has high heat dissipation efficiency. The embedded manifold type micro-channel of the present invention has the advantages of short flow distance, low flow resistance, and low thermal resistance, and is more suitable for being integrated into a high-power chip for efficient heat dissipation.

Dependencies are inferred from the claim text.