Semiconductor package including dummy package
AssigneeSamsung Electronics Co., Ltd.
InventorsByunghan KO, Doil Kong, Hu Zhao
Life of this patent
Estimating the term…
Abstract
The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.
Claims27
A semiconductor package, comprising:
- a solid-state drive (SSD) device comprising:
- a printed circuit board comprising a memory region;
- a plurality of memory packages disposed on the memory region;
- and
- at least one dummy package disposed on the memory region,
- wherein the at least one dummy package is electrically coupled with the printed circuit board, and
- wherein the at least one dummy package comprises a first pad constituting a heat path through which heat of the printed circuit board is dissipated.
(canceled)
8-9. (canceled)
(canceled)
A semiconductor package, comprising:
- a printed circuit board comprising a first surface and a second surface opposite to the first surface;
- a dummy package mounted on the first surface;
- and
- a memory package aligned with the dummy package in a direction perpendicular to the first surface and the second surface and mounted on the second surface,
- wherein the dummy package comprises:
- a first pad electrically coupled with the printed circuit board;
- and
- a metal layer electrically coupled with the first pad.
(canceled)
21-22. (canceled)
(canceled)
A semiconductor package, comprising:
- a printed circuit board comprising a first surface and a second surface opposite to the first surface;
- a dummy package mounted on the first surface;
- a memory package aligned with the dummy package in a direction perpendicular to the first surface and the second surface and mounted on the second surface;
- and
- a driving package mounted on at least one of the first surface and the second surface,
- wherein a driving circuit configured to drive a memory chip of the memory package is formed on the at least one of the first surface and the second surface,
- wherein the dummy package is electrically coupled with the printed circuit board through a bump,
- wherein the dummy package comprises a pad constituting a heat path through which heat of the printed circuit board is dissipated,
- wherein the memory package comprises a NAND flash memory device, and
- wherein the driving circuit of the driving package comprises a storage controller configured to control the NAND flash memory device.
29-30. (canceled)
Dependencies are inferred from the claim text.