Thermal resistor and method of manufacturing the same

An integrated circuit (IC) device comprising:

• a resistor comprising:
• first and second metal segments extending in a first direction in a fifth lowest metal layer of the IC device;
• and
• a third metal segment extending in a second direction perpendicular to the first direction in a fourth lowest metal layer of the IC device, wherein the third metal segment is configured to electrically connect the first and second metal segments to each other;
• and
• a heat transfer structure electrically isolated from the resistor, the heat transfer structure comprising:
• fourth and fifth metal segments extending in the first direction in the fifth lowest metal layer adjacent to the first and second metal segments, respectively;
• sixth and seventh metal segments extending in the second direction in the fourth lowest metal layer, wherein each of the sixth and seventh metal segments is configured to electrically connect the fourth and fifth metal segments to each other;
• and
• a thermally conductive path extending from one of the sixth or seventh metal segments to an underlying active area, wherein the thermally conductive path comprises eighth through tenth metal segments in corresponding first through third lowest metal layers of the IC device.

An integrated circuit (IC) device comprising:

• a resistor comprising:
• a plurality of first metal segments extending in a first direction in a first metal layer;
• a plurality of second metal segments extending in a second direction perpendicular to the first direction in a second metal layer below the first metal layer, each second metal segment being configured to electrically connect first pairs of the first metal segments to each other at first ends of the first metal segments;
• and
• a plurality of third metal segments extending in the second direction in the second metal layer, each third metal segment being configured to electrically connect second pairs of the first metal segments to each other at second ends of the first metal segments;
• and
• a heat transfer structure electrically isolated from the resistor, the heat transfer structure comprising:
• a plurality of fourth metal segments extending in the first direction in the first metal layer between the plurality of first metal segments;
• a plurality of fifth metal segments extending in the second direction in the second metal layer, each fifth metal segment being electrically connected to each overlying fourth metal segment of the plurality of fourth metal segments;
• and
• a thermally conductive path extending from a fifth metal segment of the plurality of fifth metal segments to an underlying active area.