Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductor

A method for manufacturing an embedded and packaged heat dissipation structure, comprising:

• a) forming a first semi-finished plate, wherein the first semi-finished plate comprises an embedded device and a first metal layer, and wherein the first metal layer is attached to a non-pin surface of the embedded device;
• b) forming a heat dissipation plate based on the first metal layer, wherein the heat dissipation plate is attached to the non-pin surface of the embedded device;
• c) manufacturing a heat dissipation copper column on the heat dissipation plate;
• d) providing a dielectric layer, wherein the dielectric layer covers the heat dissipation copper column;
• e) laminating a second metal layer on the dielectric layer;
• f) partially etching the second metal layer and the dielectric layer to form a microchannel, wherein the heat dissipation copper column and the heat dissipation plate are arranged inside the microchannel, and an outlet and an inlet of the microchannel are both arranged on a side surface of the first semi-finished plate perpendicular to a direction of the first semi-finished plate;
• g) manufacturing a thin metal layer to enable an inner wall of the microchannel to form an isolation layer with an integrated structure to obtain a second semi-finished plate;
• h) manufacturing a first cover layer;
• and
• i) laminating the first cover layer and the second semi-finished plate to connect the first cover layer and the isolation layer in a sealed manner to obtain the embedded and packaged heat dissipation structure.