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US 2024/0266243 A1Published application
System in a package (sip) thermal management
AssigneeOctavo Systems LLC
InventorsEshtaartha BASU, Erik James WELSH, Masood MURTUZA
Life of this patent
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Abstract
A unified design process for a System in a Package (SiP) device that includes optimizing desired thermal performance, including methods and structures for optimizing the thermal management of the SiP. A plurality of active components are separated by one or more thermal barriers. The proper thermal testing location may be indicated on a surface of the SiP packaging.
Claims21
1-39. (canceled)
A System in a Package, SiP, apparatus, comprising:
- a substrate having a plurality of layers with etched conductive paths and a first plurality of vias associated therewith for making operative interconnections between devices mounted on the substrate;
- a first active device mounted in a first area of the substrate and having a first maximum operating temperature or tolerance;
- a second active device mounted in a second area of the substrate and having a second maximum operating temperature or tolerance;
- and
- a thermal barrier that thermally isolates the first device from the second device.
2 more elements
Dependencies are inferred from the claim text.