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US 2024/0266240 A1Published application
Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsAkio KATSUBE, Hideki SHINKAI
Life of this patent
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Abstract
A module includes a substrate, a first component, and a sealing resin. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component includes a projecting portion. The projecting portion projects from the sealing resin on a side opposite to a side of the substrate.
Claims18
A module comprising:
- a substrate having a first surface;
- a first component mounted on the first surface;
- and
- a sealing resin sealing the first component at least from a lateral side, wherein
- the first component includes a projecting portion projecting from the sealing resin on a side opposite to a side of the substrate.
2 more elements
Dependencies are inferred from the claim text.