Chip package unit with outer protective layer and method of manufactuirng the same

A method of manufacturing a chip package unit with an outer protective layer comprising the steps of:

• Step S1:
• providing a wafer;
• wherein the wafer is provided with a plurality of rectangular dies arranged in an array and a plurality of cutting channels for dividing the wafer;
• each of the cutting channels is disposed between the two adjacent rectangular dies;
• Step S2:
• forming at least one outer protective layer on a surface of the wafer;
• wherein the respective outer protective layers are covering the respective cutting channels of the wafer;
• and
• Step S3:
• performing a sawing process in which a cutting tool is used to divide the rectangular dies from the wafer by cutting along the respective cutting channels of the wafer and thus a plurality of chip package units is formed;
• wherein during the sawing process, the cutting tool is first cutting the respective outer protective layers on the wafer and then continuously moved downward to cut the respective cutting channels of the wafer;
• thereby four sides of the respective outer protective layers on the respective chip package units are flush with four sides of the rectangular die after being divided from the wafer and the respective outer protective layers on the respective chip package units are located on a surface of the rectangular die.