A semiconductor transistor package having electrical contact layers and a method for fabricating the same

A method for fabricating a plurality of semiconductor packages, the method comprising:

• providing a panel comprising a plurality of interconnected die carriers;
• disposing a plurality of semiconductor dies on the die carriers, each of the semiconductor dies comprising one or more contact pads on a first main face of the semiconductor die;
• connecting at least one electrical connector to each one of the contact pads of the semiconductor dies;
• singulating the panel into a plurality of intermediate products along separation lines between the die carriers;
• disposing the intermediate products on a temporary carrier;
• fabricating a plurality of semiconductor packages by applying an encapsulant at least partially to the semiconductor dies and to the die carriers so that the at least one electrical connector extends to a main face of the encapsulant of the semiconductor packages;
• separating the semiconductor packages from each other;
• and
• removing the temporary carrier.

A semiconductor package, comprising:

• a die carrier;
• a semiconductor die disposed on the die carrier, the semiconductor die comprising one or more contact pads on a first main face of the semiconductor die;
• and
• an encapsulant applied at least partially to the semiconductor die, the encapsulant embedding at least one electrical connector, the at least one electrical connector being connected with a contact pad or with the die carrier and extending to a main face of the encapsulant.