Back to results
US 2024/0266221 A1Published application
Processing method of workpiece
AssigneeDisco Corporation
InventorsJinyan ZHAO, Shigenori HARADA
Life of this patent
Estimating the term…
Abstract
A processing method of a workpiece includes a division step of dividing into a plurality of chips the workpiece held on a first surface of a sheet, a tightly bonding step of, after the division step, heating at least either the sheet or the workpiece to soften the sheet and tightly bonding the sheet to the chips, and a cleaning step of, after the tightly bonding step, cleaning the workpiece.
Claims4
A processing method of a workpiece, comprising:
- a division step of dividing the workpiece held on a first surface of a sheet into a plurality of chips;
- a tightly bonding step of, after the division step, heating at least either the sheet or the workpiece to soften the sheet and tightly bonding the sheet to the chips;
- and
- a cleaning step of, after the tightly bonding step, cleaning the chips.
1 more element
Dependencies are inferred from the claim text.