Electrostatic Chuck

An electrostatic chuck assembly, comprising:

• a body including a body recess;
• a heat transfer plate disposed in the body recess, wherein the heat transfer plate includes an upper surface, a lower surface, a first opening, and a second opening;
• an RF transmission tube configured to transfer RF power to the lower surface of the heat transfer plate, the RF transmission tube including:
• a shaft including a bore;
• and
• a head extending from the shaft and including a recess in communication with the bore, wherein the head is engaged with the lower surface of the heat transfer plate;
• a puck bonded to the upper surface of the heat transfer plate;
• a first chucking electrode disposed in the first opening and a second chucking electrode is disposed in the second opening, wherein the first and second chucking electrodes are configured to transfer a chucking voltage to the puck.

A method of processing a substrate, comprising:

• chucking a first substrate to a puck bonded to an upper surface of a heat transfer plate by applying a chucking voltage to the puck using a first chucking electrode and a second chucking electrode disposed in the heat transfer plate, wherein first and second chucking electrode have opposing polarities;
• igniting a plasma above the first substrate chucked to the puck using a first RF power, wherein the first RF power is transferred from an RF transmission tube to the heat transfer plate at a continuous interface between the heat transfer plate and a head of the RF transmission tube, wherein the head extends from a shaft of the RF transmission tube and includes a head recess that is in communication with a bore of the shaft;
• and
• processing the first substrate using a second RF power, wherein the second RF power is transferred from the RF transmission tube to the heat transfer plate at the continuous interface.