Back to results
US 2024/0266199 A1Published application
Alignment apparatus and method of alignment using the same
AssigneeSamsung Display Co., Ltd.
InventorJe Hyeon YOON
Life of this patent
Estimating the term…
Abstract
An alignment apparatus includes a support substrate having a first alignment mark formed thereon, and a wafer mounted on the support substrate as aligned to the first alignment mark. The first alignment mark includes a first mark extending in a first direction, a second mark extending in a second direction and intersecting the first mark at a side of the first mark, and a third mark extending in the second direction and intersecting the first mark at another side of the first mark.
Claims20
An alignment apparatus comprising:
- a support substrate having a first alignment mark formed thereon;
- and
- a wafer mounted on the support substrate as aligned to the first alignment mark, wherein the first alignment mark includes:
- a first mark extending in a first direction;
- a second mark extending in a second direction and intersecting the first mark at a side of the first mark;
- and
- a third mark extending in the second direction and intersecting the first mark at another side of the first mark.
4 more elements
A method of alignment, the method comprising:
- aligning a position of a wafer by using a first alignment mark formed on a support substrate,
- wherein the first alignment mark includes:
- a first mark extending in a first direction;
- a second mark extending in a second direction and intersecting the first mark at a side of the first mark;
- and
- a third mark extending in the second direction and intersecting the first mark at another side of the first mark.
3 more elements
Dependencies are inferred from the claim text.