Subminiature optical transmission module and method for manufacturing same by using semiconductor packaging scheme

Abstract

Provided are an optical transmission module including: a mold body having a first surface and a second surface opposite to the first surface; edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in an edge direction of a chip; and an optical component disposed on one side of the edge-type light emitting elements and molded inside the mold body, the optical component includes, on one side thereof, a plurality of input waveguides corresponding to the edge-type light emitting elements, and optically processes or transmits the plurality of optical signals incident through the plurality of input waveguides, and an optical axis of each of the light emitting elements and an optical axis of each of the input waveguides of the optical component is optically aligned.

Dependencies are inferred from the claim text.