Circuit board structure, information processing method and apparatus, and communication device

A communication device, comprising a circuit board structure, wherein the circuit board structure comprises:

• a circuit board substrate, a temperature drift processing chip, and at least two heat-sensitive elements;
• the circuit board substrate comprising a first substrate and a second substrate opposite the first substrate;
• wherein
• the first substrate is provided with a heat-generating device;
• and the second substrate has a cavity, the cavity being provided with at least one boss extending toward the first substrate;
• and
• the heat-generating device is located between the first substrate and the boss;
• the at least two heat-sensitive elements are disposed at a peripheral position of the heat-generating device;
• and the temperature drift processing chip is electrically connected to the at least two heat-sensitive elements, and the temperature drift processing chip is disposed on the circuit board substrate.

An information processing method, applied to a communication device comprising a circuit board structure, wherein the circuit board structure comprises:

• a circuit board substrate, a temperature drift processing chip, and at least two heat-sensitive elements;
• the circuit board substrate comprising a first substrate and a second substrate opposite the first substrate;
• wherein
• the first substrate is provided with a heat-generating device;
• and the second substrate has a cavity, the cavity being provided with at least one boss extending toward the first substrate;
• and
• the heat-generating device is located between the first substrate and the boss;
• the at least two heat-sensitive elements are disposed at a peripheral position of the heat-generating device;
• and the temperature drift processing chip is electrically connected to the at least two heat-sensitive elements, and the temperature drift processing chip is disposed on the circuit board substrate;
• wherein the information processing method comprises:
• obtaining first temperature information collected by each heat-sensitive element disposed at a peripheral position of a heat-generating device;
• obtaining calibration parameter information based on the first temperature information;
• and
• sending the calibration parameter information to a signal processing chip corresponding to the heat-generating device;
• wherein
• the calibration parameter information is used for signal calibration by the signal processing chip.