Acoustic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi YAMANE
Life of this patent
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Abstract
An acoustic wave device includes a mounting substrate; an acoustic wave element on one major surface of the mounting substrate in its thickness direction, and a bump between the acoustic wave element and the mounting substrate. The acoustic wave element includes a support substrate including an air gap, a piezoelectric layer stacked on the support substrate and including an overlap region at least partially overlapping the air gap as viewed in the stacking direction, and a functional electrode located in the overlap region of the piezoelectric layer. The mounting substrate includes a metal portion. A fixed capacitance generated between the acoustic wave element and the mounting substrate is not less than a variable capacitance generated between the acoustic wave element and the mounting substrate.
Claims12
An acoustic wave device, comprising:
- a mounting substrate;
- an acoustic wave element on one major surface of the mounting substrate in a thickness direction of the mounting substrate;
- and
- a bump between the acoustic wave element and the mounting substrate;
- wherein
- the acoustic wave element includes:
- a support substrate including an air gap;
- a piezoelectric layer stacked on the support substrate and including an overlap region at least partially overlapping the air gap as viewed in a stacking direction of the piezoelectric layer;
- and
- a functional electrode located in the overlap region of the piezoelectric layer;
- the mounting substrate includes a metal portion;
- and
- a fixed capacitance generated between the acoustic wave element and the mounting substrate is not less than a variable capacitance generated between the acoustic wave element and the mounting substrate.
An acoustic wave device, comprising:
- a mounting substrate;
- an acoustic wave element on one major surface of the mounting substrate in a thickness direction of the mounting substrate;
- and
- a bump between the acoustic wave element and the mounting substrate;
- wherein
- the acoustic wave element includes:
- a support substrate including an air gap;
- a piezoelectric layer stacked on the support substrate and including an overlap region at least partially overlapping the air gap as viewed in a stacking direction of the piezoelectric layer;
- and
- a functional electrode located in the overlap region of the piezoelectric layer;
- the mounting substrate includes a metal portion;
- and
- the acoustic wave device satisfies:
- H×W≥about 4442.9 μm·nm
- where H is a bump dimension as a dimension of the bump in the stacking direction and W is a piezoelectric layer dimension as a dimension of the piezoelectric layer in the stacking direction.
Dependencies are inferred from the claim text.