Self-Fitting Pressure Equalizing Waterproof Electronics Enclosure

An electronic device enclosure comprising:

• a housing comprising an opening configured to receive electronic components through the opening;
• and,
• a cover configured to couple to the housing and cover the opening of the housing, wherein the cover comprises:
• a top surface extending on a horizontal plane,
• an edge surface orthogonal to the top surface around a perimeter of the cover, and,
• at least one self-aligning element extending orthogonal to the edge surface, wherein the at least one self-aligning element comprises:
• a size and a distribution along the edge surface configured to align the cover in a relative position to the housing, and to withstand a predetermined minimum displacement force threshold, such that,
• in an assembling process, the at least one self-aligning element is permanently deformed by an assembly force less than a predetermined maximum assembly force threshold, and the relative position is within a predetermined maximum displacement threshold.

An electronic device enclosure manufacturing method, comprising:

• provide a housing body and a cover to be coupled to the housing body;
• identify a tolerance measurement for self-alignment of the cover relative to the housing body;
• determine a number of at least one self-aligning element to be placed around an edge surface of the cover;
• determine a size of the at least one self-aligning element based on the tolerance measurement and the number of at least one self-aligning element, such that:
• the size of the at least one self-aligning element is less than a maximum allowable size,
• a resulting frictional force between the housing body and the cover is higher than a predetermined displacement force, and,
• an assembly force required to couple the cover to the housing body is less than a maximum assembly force, such that a leakage problem of the electronic device enclosure is mitigated.