Microelectronic device package with integrated antenna
AssigneeTexas Instruments Incorporated
InventorJuan Alejandro Herbsommer
Life of this patent
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Abstract
A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.
Claims22
An apparatus, comprising:
- a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having a bond pad on a device side surface facing away from the die pad;
- a bond wire coupling the bond pad to a lead of the package substrate, the lead spaced from the die pad;
- an antenna including a first conductor and a first feed line, a portion of the first feed line coupled to the device side surface of the semiconductor die;
- and
- mold compound covering portions of the semiconductor die, the bond wire, the leads, and the antenna, wherein a surface of the first conductor is exposed from the mold compound.
An apparatus, comprising:
- a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having a bond pad on a device side surface facing away from the die pad;
- a bond wire coupling the bond pad to a lead of the package substrate, the lead spaced from the die pad;
- an antenna including a first conductor coupled to a first feed line, and a second conductor coupled to a second feed line, a portion of the first feed line coupled to the device side surface of the semiconductor die, and a portion of the second feed line coupled to the device side surface of the semiconductor;
- and
- mold compound covering portions of the semiconductor die, the bond wire, the leads, and the antenna, wherein a surface of the first conductor and a surface of the second conductor are exposed from the mold compound, and wherein a surface of the first feed line and a surface of the second feed line are exposed from the mold compound.
A method, comprising:
- mounting semiconductor dies on die pads arranged in an array of unit lead frames on a package substrate;
- forming wire bonds coupling bond pads on a device side surface of the semiconductor dies and leads of the unit lead frames that are spaced from the die pads;
- positioning an antenna gang frame having antennas in an array corresponding to the array of unit lead frames, the antennas positioned over and making contact to the device side surface of the semiconductor dies;
- and
- covering the die pads, the semiconductor dies, a portion of the leads, and a portion of the antennas with mold compound, the antennas having a surface exposed from the mold compound.
Dependencies are inferred from the claim text.