On-chip dual-mode transmission line with spoof surface plasmon based on balun
AssigneeSoutheast University
InventorsDi BAO, Tiejun CUI, Kai LU, Chenchen LI, Jiemin WU
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AssigneeSoutheast University
InventorsDi BAO, Tiejun CUI, Kai LU, Chenchen LI, Jiemin WU
Estimating the term…
An on-chip dual-mode transmission line with an spoof surface plasmon based on a balun includes a dual-mode transmission line located in the intermediate, the balun structures symmetrically located at both terminals of the dual-mode transmission line, and pad structures and excitation portions located outside the balun structures. The dual-mode transmission line comprises two metal strip lines that are the same in structure and parallel to each other, and the branches located between the two metal strip lines. The dual-mode transmission line can simultaneously support the transmissions of the odd-mode spoof surface plasmon signal and the even-mode spoof surface plasmon signal, and is not only suitable for III-V chips such as gallium arsenide and silicon nitride, but also suitable for technologies such as other chips and printed circuit boards.
An on-chip dual-mode transmission line with a spoof surface plasmon based on a balun, wherein a dual-mode transmission line structure comprises a dielectric adhesive, a dielectric material, a metal ground structure, metal strip lines, odd-mode signal pads, even-mode signal pads, four-port grounding, and a dual-mode transmission line located in an intermediate of the dual-mode transmission line structure, a balun structure symmetrically located at both terminals of the dual-mode transmission line, and a pad feeding structure located outside each of the balun structure;
Dependencies are inferred from the claim text.